Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-05-03
1998-04-14
Culver, Horace M.
Metal working
Method of mechanical manufacture
Electrical device making
29740, H05K 334, B23P 1900
Patent
active
057378347
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND INFORMATION
The present invention concerns a process for automatically assembling the top and bottom sides of circuitboards with SMDs and a means for carrying out this process.
As a rule, circuitboards to be assembled have a network of conductors on the bottom side, connecting the terminals of the components according to their functions. These circuitboards are conveyed through the individual processing stations by a conveyor belt and pass by means for assembling the circuitboards from overhead, so-called automatic surface mounting means or SMD assemblers that bring the components to predetermined locations on the top side of the circuitboard. For this purpose, the automatic component assemblers have gripper elements that can be guided in a horizontal plane to any point on the surface of the circuitboard. The components themselves are previously placed on a carrier that in many cases is rolled up into a roll. The components are removed from this carrier in series--for example, by an assembly suction nipple--and brought to the intended position.
After depositing all the SMDs required for the circuits on the circuitboard, the components are soldered at their terminals in a soldering station, and then the circuit is tested for proper operation.
As a result of the desire to minimize the space required by these circuits, SMDs are also arranged on the bottom of the circuitboard. After the soldering station, the circuitboard is lifted off the conveyor belt and turned over, so the bottom of the circuitboard faces up and is provided with an adhesive at the places for SMDs there. Then the circuitboard passes through a second automatic surface mounting means or SMD assembler, where additional SMDs are assembled on the bottom of the circuitboard, which is then facing upward.
After the second automatic SMD assembler, the adhesive is cured in a curing station so the components adhere well to the circuitboard. Then the circuitboard is turned over again and next it passes through a wave soldering station to solder the components to the conductors on the bottom of the circuitboard.
Components that cannot be manipulated with an assembly suction nipple may optionally be positioned manually in advance on the top of the circuitboard.
The present invention is based on the object of reducing this effort if possible.
It is general knowledge that several circuitboards can be applied on a single assembly panel, forming so-called multiple circuitboards. However, after solder paste has been applied to such multiple circuitboards and the circuitboards have been assembled and soldered, they must be separated. Methods of separating such a multiple circuitboard assembly panel into individual circuitboards are disclosed, for example, in German patent application No. 38 06 984 A1 and in German Patent No. 38 05 487 C2. It is also known from the state of the art described in German patent application P 43 42 885 of Dec. 16, 1993 that circuitboards can be supplied in a panel, where the consumers expect almost 100% good panels. For this purpose it is proposed in the latter patent application that the individual circuitboards be provided with a parting line in the component panel before they are assembled, so that circuitboards which have been identified as defective can be detached from the panel. The shape of the parting line is such that, for example, left-over intact circuitboards from one panel can be inserted into another panel and will fit there perfectly.
SUMMARY OF THE INVENTION
In the process and apparatus according to the present invention, the top of a circuitboard to which solder paste has been applied at predetermined locations and the bottom of a previously turned circuitboard to which adhesive has been applied at predetermined locations are conveyed side by side and at the same speed through the same SMD assembler and thus form one assembly panel. An apparatus for successive double reversal of the direction of conveyance of the circuitboards is also described herein.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 ill
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Graen Ansgar
Heinrich Hans-Walter
Sabotke Jens
Blaupunkt-Werke GmbH
Culver Horace M.
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