Process and apparatus for attaching/deataching land grid array c

Details Process and apparatus for attaching/deataching land grid array c Process and apparatus for attaching/deataching land grid array c

1993-09-21

1995-05-30

Bradley, P. Austin

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228264, 228191, B23K 1012

Patent

active

054194814

ABSTRACT:
Process and nozzle device for the soldering and/or desoldering of a land grid array (LGA) component and a corresponding circuit grid present on the surface of a printed circuit board (PCB). The nozzle device comprises a vacuum for supporting the LGA parallel to the PCB, with array contact, a fixed orifice gap for directing hot gas horizontally through the array, and a gas outlet. Uniform circulation of the hot gas is continued to produce uniform, simultaneous melting of the solder array to permit bonding to or desoldering from the circuit array of the PCB while supporting the component parallel to the PCB.

REFERENCES:
patent: 4552300 (1985-11-01), Zovko et al.
patent: 4564135 (1986-01-01), Barresi et al.
patent: 4767047 (1988-08-01), Todd et al.
patent: 4787548 (1988-11-01), Abbagnaro et al.
patent: 5044072 (1991-09-01), Blais et al.
patent: 5152447 (1992-10-01), Wallgren et al.
"Rework Fixture For Surface-Mounted Components", IBM Technical Disclosure Bulletin, vol. 29, No. 11, Apr. 1987, pp. 4718-4719.

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