Process and apparatus for assembling smaller scanning or printin

Details Process and apparatus for assembling smaller scanning or printin Process and apparatus for assembling smaller scanning or printin

1989-10-16

1991-07-23

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562755, 1562757, 156285, 156297, 1563797, 1563798, 430 22, 430321, 430322, B32B 3128

Patent

active

050340832

ABSTRACT:
Process and apparatus for fabricating an extended scanning or printing array in which plural smaller scanning or printing chips are bonded end-to-end onto the surface of a glass substrate having an opaque thermally and/or electrically conductive coating thereon, with the coating removed at discrete sites to allow a photocurable adhesive placed at the sites to be cured through exposure to UV light from underneath the substrate, the photocurable adhesive holding the chips in place while a chip bonding adhesive deposited on the conductive coating where the chips are located is cured to provide a permanent structure.

REFERENCES:
patent: 4388128 (1983-06-01), Ogawa et al.
patent: 4523102 (1985-06-01), Kazufumi et al.
patent: 4661191 (1987-04-01), Kamio et al.
patent: 4698113 (1987-10-01), Ogawa
patent: 4814296 (1989-03-01), Jedlicka et al.
patent: 4976802 (1990-12-01), LeBlanc

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