Process and apparatus for assembling and resin-encapsulating a h

Details Process and apparatus for assembling and resin-encapsulating a h Process and apparatus for assembling and resin-encapsulating a h

1991-10-31

1993-09-14

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437214, 437902, 26427217, H01L 2156, H01L 2158, H01L 2160, H01L 21603

Patent

active

052448380

ABSTRACT:
A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.

REFERENCES:
patent: 4377548 (1983-03-01), Pierpoint
patent: 4470786 (1984-09-01), Sand et al.
patent: 4954307 (1990-09-01), Yokoyama
patent: 5091341 (1992-02-01), Asada et al.

Affiliated with

Also associated with

Rating

Process and apparatus for assembling and resin-encapsulating a h does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process and apparatus for assembling and resin-encapsulating a h, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and apparatus for assembling and resin-encapsulating a h will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2026289