Process and apparatus for abrasive machining of a wafer-like wor

Details Process and apparatus for abrasive machining of a wafer-like wor Process and apparatus for abrasive machining of a wafer-like wor

1986-07-02

1988-04-26

Olszewski, Robert P.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51118, 511311, B24B 722

Patent

active

047395893

ABSTRACT:
A process is provided for bilateral abrasive machining of wafer-like workpieces, especially semiconductor wafers. The process uses carrier disks in which the outer periphery on which the driving forces mesh, is made of a material having a tensile strength of at least 100 N/mm.sup.2, while in the area that comes into contact with the workpieces to be machined, there is provided a plastic material having an elasticity modulus of from 1.0 to 8.10.sup.4 N/mm.sup.2.

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Western Electric, Technical Digest, Nr. 26, Apr. 1977, pp. 11,12, Western ElectricNew York, U.S.; J. T. Callahan et al., "Infrared Heat Wax Method of Mounting Crystal Plates . . . ".
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