Metal fusion bonding – Process – With shaping
Patent
1996-05-17
1997-12-09
Heinrich, Samuel M.
Metal fusion bonding
Process
With shaping
29839, B23K 100, H05K 334
Patent
active
056951108
ABSTRACT:
This disclosure describes a procedure for soldering an insulated wire where the wire end features a U- or V-shaped hook with one bending point and is introduced such into the soldering hole of a printed circuit board that the bending point protrudes from the other side of the soldering hole.
REFERENCES:
patent: 2902629 (1959-09-01), Little et al.
patent: 3566465 (1971-03-01), Weiner
patent: 3969816 (1976-07-01), Swengel, Sr. et al.
patent: 5195675 (1993-03-01), Ouden
Fasse W. F.
Fasse W. G.
Heinrich Samuel M.
TEMIC Telefunken microelectronic GmbH
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