Procedure for reproduction of a calibration position of an...

Details Procedure for reproduction of a calibration position of an... Procedure for reproduction of a calibration position of an...

2007-09-04

2007-09-04

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

Reexamination Certificate

active

11365424

ABSTRACT:
A wafer probe station is provided with a wafer chuck, a wafer fastened on the chuck by vacuum suction, and a probe needle arrangement above the wafer to test the wafer at high frequencies by contacting selected pads on the wafer and alternately pads on a calibration substrate also fastened on the wafer chuck. A procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate uses first and second measurement systems to calculate a new offset position of the calibration substrate after a second wafer is loaded on the wafer chuck. In a last step, the wafer chuck is driven by a 4axis manipulator stage to the new calibration position from the recent position.

REFERENCES:
patent: 6708131 (2004-03-01), Laursen et al.
patent: 6909984 (2005-06-01), Laursen et al.

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