Coating processes – Vacuum utilized prior to or during coating – Organic base
Reexamination Certificate
1999-09-07
2001-11-13
Talbot, Brian K. (Department: 1762)
Coating processes
Vacuum utilized prior to or during coating
Organic base
C427S096400
Reexamination Certificate
active
06316056
ABSTRACT:
FIELD OF THE INVENTION
The present invention involves the manufacturing process isolation copper facing membranes, particulary a manufacturing process for facing copper on a polyimide isolation membrane in a vacuum while controlling the thickness of copper facing.
BACKGROUND OF THE INVENTION
Generally the material for printed circuit board have to be very soft and bendable. The necessary kinds of materials are widely use for notebook computers, electric translator and similar products. Presently, in the fields of such related products industrial most materials which are used for printed circuit boards include the polyimide isolation membrane “KAPTON” which made by DuPont Company, and a thin copper foil is added on top of it. The must be carved very carefully when put on the board. Also, the strength of attachment is extremely important. Besides the strength of attachment, the glue material is also a very important factor which may reduce the quality of the printed circuit board. Presently most attachment glues for printed circuit boards are imported, and the price is very high for domestic manufacture. The cost and quality for such attachment glues is a quite important problem for industrial nations, including Taiwan.
Therefore, the present invention includes a simpler and less costly manufacturing process for isolation copper facing membranes, especially a manufacturing process for facing copper on polyimide isolation membranes in a vacuum and further control the thickness of copper facing.
SUMMARY OF THE INVENTION
An object of the present invention is to provide an improved manufacturing process for copper facing, thus providing a whole new manufacturing process for isolation copper facing membranes. The invention not only avoids slippage of components but also reduces the cost for attachment glues.
REFERENCES:
patent: 5346730 (1994-09-01), Kruck et al.
patent: 5900186 (1999-05-01), Fakler et al.
Helix Thechnology Inc.
Rabin & Berdo P.C.
Talbot Brian K.
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