Procedure for processing joints to be soldered

Details Procedure for processing joints to be soldered Procedure for processing joints to be soldered

1990-11-05

1993-03-09

Lusignan, Michael

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228205, 427 96, 427534, 118 50, 118623, C23C 2600

Patent

active

051925826

ABSTRACT:
The invention is directed to a procedure for processing joints to be soldered, preferably printed circuit boards fitted with electric components, and an arrangement for executing this procedure, wherein the joints are subjected to plasma treatment before the soldering process. The joints may be subjected to plasma treatment separately or in the relative position necessary for the soldering process.

REFERENCES:
patent: 3592992 (1971-07-01), Costello
patent: 4208159 (1980-06-01), Uehara
patent: 4383494 (1983-05-01), Schillke
patent: 4887762 (1989-12-01), Baker
patent: 4921157 (1990-05-01), Dishon

Affiliated with

Also associated with

Rating

Procedure for processing joints to be soldered does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Procedure for processing joints to be soldered, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Procedure for processing joints to be soldered will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-209962