Procedure for positioning a through-hole in a substrate

Details Procedure for positioning a through-hole in a substrate Procedure for positioning a through-hole in a substrate

2005-07-25

2008-08-26

Yan, Ren (Department: 2854)

Printing

Stenciling

Stencils

C430S308000, C430S945000

Reexamination Certificate

active

07415927

ABSTRACT:
A method for forming openings of predetermined position in a substrate in the form of a printing stencil by means of a laser, wherein the substrate is positioned using a fixture means in the form of a tensioning frame. In the process, a shift in position of openings resulting from subsequent processing steps and leading to a changed state of stress of the substrate is prevented by first determining the coordinates of a central reference point. Then, the respective distances of the predetermined positions of the openings from this reference point are determined, and an order of priority is determined therefrom. This order of priority then forms the basis for a machining program, which controls the path of movement of the laser head and forms the openings in the substrate.

REFERENCES:
patent: 5444212 (1995-08-01), MacNaughton et al.
patent: 5580698 (1996-12-01), Andersen
patent: 5588359 (1996-12-01), Hofmann et al.
patent: 5822209 (1998-10-01), Fischer
patent: 5875712 (1999-03-01), Ericsson et al.
patent: 6165658 (2000-12-01), Taff et al.
patent: 6286423 (2001-09-01), McCue et al.
patent: 6766736 (2004-07-01), Regner et al.
patent: 6890689 (2005-05-01), Schaetz
patent: 6906282 (2005-06-01), Hamada
patent: 7003871 (2006-02-01), Ray
patent: 2003/0041753 (2003-03-01), Regner et al.
patent: 2003/0137568 (2003-07-01), Shinada et al.
patent: 100 34 648 (2002-01-01), None
patent: 101 41 497 (2003-03-01), None
patent: 2 276 589 (1994-10-01), None
patent: 04 099626 (1992-03-01), None
European Search Report for EP 05 01 5017, dated Oct. 25, 2005.

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