Procedure for copper plating aluminium wire and product thereof

Details Procedure for copper plating aluminium wire and product thereof Procedure for copper plating aluminium wire and product thereof

1974-12-12

1976-05-18

Kaplan, G. L.

Metal working

Means to assemble or disassemble

Puller or pusher means, contained force multiplying operator

29197, 204 27, 204 28, 204 38B, 204 52R, 204206, 204207, 204238, 204276, B23P 300, C25D 510, C25D 530, C25D 706

Patent

active

039574520

ABSTRACT:
This method of copper plating aluminum and aluminum alloy wire or strip applies an adherent and ductile plating while the wire is moving rapidly and continuously through the plating apparatus. An improved chemical zincating step followed by a copper pyrophosphate strike plating, within critical thickness limits, reduces the plating time and makes practical plating of the wire while moving at speeds of about 100 feet per minute or more in relation to the processing solution.

REFERENCES:
patent: 1405534 (1922-02-01), Merritt
patent: 2676916 (1954-04-01), Zelley
patent: 2995814 (1961-08-01), Chamness
patent: 3108006 (1963-10-01), Kenedi et al.
A. Kenneth Graham, "Electroplating Engineering Handbook", pp. 722-724, (1962).

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