Probing plate for wafer testing

Details Probing plate for wafer testing Probing plate for wafer testing

1989-07-17

1990-10-02

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158F, G01R 3102, G01R 106

Patent

active

049610520

ABSTRACT:
A probing plate for wafer testing is provided with a plurality of probes arranged so as to correspond to a plurality of bonding pads of semiconductor devices fabricated on a semiconductor wafer. The probing plate has a base plate formed of an insulating material, such as a photosensitive glass, and has contact fingers each having a raised portion in the free end thereof, contact conductors respectively formed on the surfaces of the raised portions of the contact fingers so as to be brought into contact with the corresponding bonding pads, and wiring conductors formed in a predetermined pattern on the surface of the base plate so as to extend respectively from the contact conductors. The contact conductors and the wiring conductors are formed simultaneously by a photolithographic process. The contact fingers and the raised portions thereof are also formed by subjecting the base plate to a photolithographic process. Forming the contact conductors over the surfaces of the raised portions of the contact fingers prevents accidental contact of the contact conductors with the bonding pads of semiconductor devices other than the objective semiconductor devices.

REFERENCES:
patent: 3445770 (1969-05-01), Harmon
patent: 3810016 (1974-05-01), Chayka et al.
patent: 4585991 (1986-04-01), Reid et al.
patent: 4649338 (1987-03-01), Dugan
patent: 4649339 (1987-03-01), Grangroth et al.
"Membrane Probe Card Technology", by Leslie et al., 1988, International Test Conference, Paper No. 30.1.

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