Probing apparatus and test method including electrical...

Details Probing apparatus and test method including electrical... Probing apparatus and test method including electrical...

2007-02-06

2007-02-06

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB

Reexamination Certificate

active

10983512

ABSTRACT:
There is provided a prober that includes a chuck, a support base that supports the chuck, a first inner shield that shields the chuck, and an outer shield that encloses the chuck and the first inner shield. The outer shield is connected to a chassis, the chuck is connected to a first connector by a first cable, and the first inner shield is connected to a second connector by a second cable with an impedance device in between.

REFERENCES:
patent: 2884597 (1959-04-01), Miller
patent: 6002263 (1999-12-01), Peters et al.
patent: 6636059 (2003-10-01), Harwood et al.
patent: 06-053297 (1994-02-01), None
patent: 07-084003 (1995-03-01), None
patent: 2001-296547 (2001-10-01), None
Cascade Microtech, Inc., “The Industry Standard in On-Wafer Device Characterization Summit Wafer Probing Systems”, 2004.

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