Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2008-07-29
2008-07-29
Nguyen, Ha (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S761010
Reexamination Certificate
active
07405584
ABSTRACT:
A prober that has improved positional precision of probing without reducing throughput is disclosed. The prober comprises a probe card having a probe, a wafer stage, a stage temperature adjustment mechanism, a wafer stage movement mechanism, a movement control section, and an alignment mechanism that detects the relative position between an electrode and the probe, wherein the movement control section controls the movement mechanism so as to cause the electrode to come into contact with the probe based on the detected relative position, and the prober further comprises a plurality of temperature sensors that detect the temperatures of a plurality of portions of the prober including the wafer stage and a predicted change amount calculation section that calculates the amount of change in relative position between the electrode and the probe based on a prediction model that uses at least part of the temperatures of the plurality of portions and the temperature difference between the wafer stage and the other sections as a variable.
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Patent Abstracts of Japan, Publication No. 2004-039752, Published on Feb. 5, 2004, in the name of Houkida, et al.
Fujita Taichi
Hata Tetsuo
Hokida Takahiro
Moriyama Satoshi
Yokoyama Yoshiyuki
Christie Parker & Hale LLP
Isla-Rodas Richard
Nguyen Ha
Tokyo Seimitsu Co. Ltd.
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