Probe system and probe method

Details Probe system and probe method Probe system and probe method

1996-04-18

1997-06-17

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324 731, 324690, G01R 1067, G01R 102

Patent

active

056401019

ABSTRACT:
A probe system tests the electrical characteristics of chips arranged in a matrix on a semiconductor wafer. An XYZ stage movable in the directions of three-dimensional axes is disposed under a probe card having probes to be brought into contact with the electrode pads of the chips. A wafer table rotatable within a horizontal plane is disposed on the XYZ stage. A first image pickup means for picking up the probe images is mounted on the XYZ stage. A second image pickup means for picking up a wafer image is disposed above the table. The second image pickup means is movable horizontally to and from a use position under the probe card. A target is supported and moved by a driving member mounted on the XYZ stage, for aligning the focal points and optical axes of the first and second image pickup means. The target is moved between forward and retreat positions within and outside the field of view of the first image pickup means. At the forward position, the target provides a reference point aligned with the focal point of the first image pickup means. The table, the stage, and the image pickup means are connected to control and processing section which manages the position of the stage based on the three-dimensional coordinate system defined by the pulse count of encoders.

REFERENCES:
patent: 4929893 (1990-05-01), Sato et al.
patent: 5091692 (1992-02-01), Ohno et al.
patent: 5321352 (1994-06-01), Takebuchi
Patent Abstracts of Japan, vol. 17, No. 625 (E-1461), Nov. 18, 1993, JP-A-5-198662, Aug. 6, 1993.
11th International Electronics Manufacturing Technology Symposium, pp. 429-433, Sep. 16-18, 1991, "Probe for Highly Integrated Multichip Modules", Tomoaki Sakata, et al.

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