Probe structure for measuring electric characteristics of a semi

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324754, G01R 3102

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active

055766307

ABSTRACT:
A probe structure for measuring electric characteristics of a semiconductor element containing a first electrically conductive circuit board having a structure wherein the contact portions, which are contacted with the terminals of a material to be tested, are disposed in a first insulator in the direction of the thickness thereof so as to penetrate the insulator and are connected to a first electrically conductive wiring formed between the first insulator and a second insulator. The probe structure also contains a second electrically conductive circuit board having a coefficient of thermal expansion which is the same as or similar to that of the material to be tested and having a structure wherein the first electrically conductive wiring is connected to a second electrically conductive wiring which, in turn, is connected to an electric tester for testing the electric characteristics of the material to be tested. The first electrically conductive circuit board is electrically connected to the second electrically conductive circuit board, and an elastic body is disposed between the first electrically conductive circuit board and the second electrically conductive circuit board.

REFERENCES:
patent: 4189825 (1980-02-01), Robillard et al.
patent: 4912399 (1990-03-01), Greub
patent: 5027063 (1991-06-01), Letourneau
patent: 5103557 (1992-04-01), Leedy
G. O. Jameson, "Frost Free Cold Probe", IBM Technical Disclosure Bulletin, vol. 13, No. 10, Mar. 1971, p. 3121.
Moskowitz, "Electrical Performance of High Density Probe Array For Testing Josephson Circuit Chips", IEEE Transactions on Magnetics, vol. MAG-17, No. 1, Jan. 1981, pp. 761-763.

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