Electrical connectors – Including handle or distinct manipulating means – Randomly manipulated implement
Reexamination Certificate
2002-05-15
2003-10-28
Ta, Tho D. (Department: 2833)
Electrical connectors
Including handle or distinct manipulating means
Randomly manipulated implement
C439S700000, C439S824000, C439S066000
Reexamination Certificate
active
06638097
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a probe structure, and more specifically to a probe structure using a combination of a probe body and a resilient member so that the probe body can elastically return to its initial state and can be automatically aligned or properly guided.
2. Description of the Related Art
In general, after traces are formed in printed circuit boards, the circuit boards have to be tested to make sure that each trace is normally conductive. After the test, the printed circuit boards having perfect electric traces are picked out for electrical elements to be mounted on.
Referring to
FIG. 6
, a conventional test jig for printed circuit boards includes a pin board
10
, a plurality of probes
12
and middle boards
14
. The pin board
10
is formed with pin holes
16
corresponding to the positions of to-be-tested devices
13
of a to-be-tested object
11
(a printed circuit board in this example). Each probe
12
is composed of a probe sleeve
18
, a cylinder
20
, a spring
22
and a probe body
24
. The probe sleeve
18
is inserted into a predetermined pin hole
16
of the pin board
10
and has one end connected to a wire
19
for transmitting signals to a test machine (not shown). The spring
22
is received within the cylinder
20
into which the probe body
24
is inserted. According to the retractable force of the spring
22
, the probe body
24
is retractable within the cylinder
20
. Then, the cylinder
20
is mounted within the probe sleeve
18
. Accordingly, the overall probe
12
is mounted on the pin board
10
. The middle board
14
is also formed with middle holes
26
corresponding to the pin holes
16
of the pin board
10
, respectively. The probe body
24
passes through a predetermined middle hole
26
of the middle board
14
, projects over the middle board
14
, and passes through a predetermined through hole
17
formed on a top board
15
located above the middle board
14
.
Thereafter, a printed circuit board
11
is placed above the top board
15
, and the test machine is used to make the to-be-tested device
13
of the printed circuit board
11
in contact with the probe body
24
of the probe
12
. Then, electrical signals are in turn transferred to the spring
22
, the probe sleeve
18
, and the test machine via the wire
19
connected to the bottom of the probe sleeve
18
. Next, the test machine judges whether or not the to-be-tested device can be turned on, and the test process of the printed circuit board
11
is thus completed.
The above-mentioned test method and the probe structure have the following drawbacks.
1. When the probe
12
contacts the to-be-tested device
13
of the to-be-tested object
11
, the probe
12
has to possess retractable restoring force so that the electrical property of the to-be-tested device
13
can be free from being damaged. Therefore, the probe body
24
has to be placed within the cylinder
20
having the spring
22
mounted therein so as to automatically restore to its initial state before being compressed. In such a structure, the overall volume of the probe
12
cannot be easily made small. Thus, the manufacturing cost of the probe
12
is high when it is made very small, thereby increasing the testing cost. Accordingly, the test density cannot be effectively increased.
2. Since the size of the probe sleeve
18
has to mate with that of the probe
12
, the size of the probe sleeve
18
is correspondingly limited and the overall test density of the pin holes
16
of the pin board
10
cannot be increased. Therefore, the circuit board
11
having to-be-tested devices
13
with a high density cannot be tested.
3. Since the electrical signals from the to-be-tested device
13
of the printed circuit board
11
are transferred via the contacts between the probe body
24
and the resilient member
22
, between the resilient member
22
and the cylinder
20
, and between the cylinder
20
and the probe sleeve
18
, the phenomenon of poor signal transfer effect may occur after multiple contacts between such members. Thus, the test quality for the printed circuit board may be influenced, and especially poor in testing the to-be-tested devices with a high density.
4. Since the probe
12
is mounted on the pin board
10
and is not detachable, the pin board
10
and the probe
12
may not be used after a batch of printed circuit boards is tested. Therefore, the testing cost is increased and the source is wasted.
In view of this, the improved structure of the probe is provided to overcome the above-mentioned drawbacks.
SUMMARY OF THE INVENTION
It is therefore an object of the invention to provide an improved probe structure capable of facilitating the manufacturing processes and effectively lowering the manufacturing cost.
Another object of the invention is to provide a common test jig capable of testing to-be-tested devices with a high density and lowering the testing cost.
Still another object of the invention is to provide a common test jig capable of improving the testing conductivity and the testing result.
Yet still another object of the invention is to provide a common test jig, which can be recycled so that the manufacturing cost can be lowered.
Still another object of the invention is to provide an improved probe structure capable of aligning the probe so as to achieve a more precise testing result.
To achieve the above-mentioned objects, the invention provides a probe for testing a to-be-tested object having at least one to-be-tested device. The probe is inserted into a pin hole formed on a pin board and contacts the to-be-tested device. The probe includes a probe body and a resilient member. The probe body has an insertion portion and a head contacting the to-be-tested device. The resilient member is placed within the pin hole of the pin board and has a top end and a bottom end. The top end is formed with a support portion contacting the insertion portion of the probe body when the probe body is inserted into the pin hole. Thus, the probe body can be elastically restored and properly guided.
REFERENCES:
patent: 5600883 (1997-02-01), Faure et al.
patent: 6305969 (2001-10-01), Sato
patent: 6471524 (2002-10-01), Nakano et al.
patent: 3521012 (1985-12-01), None
Wu Ji-chen
Yang Burton
Pro-Techtor Inter-national Services
Ta Tho D.
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