Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-01-31
2008-10-14
Nguyen, Vinh P (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S761010, C324S762010
Reexamination Certificate
active
07436192
ABSTRACT:
A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a square front, a round back and a flat middle section. The conductive pad is of generally convex shape having a granular non-conductive surface of debris and moves to engage the skate, whereby an overdrive motion is applied to the pad causing the skate to move across and scrub non-conductive debris from the pad displacing the debris along the skate and around the skate round back end to a position on the skate that is away from the pad.
REFERENCES:
patent: 7109731 (2006-09-01), Gleason et al.
patent: 7148709 (2006-12-01), Kister
Bennett, Scott et al. “Precision Point Probe Card Analyzers: Probe Force,” pp. 1-4. 2003. Applied Precision. www.appliedprecision.com.
Broz, Jerry J. et al. “Controlling Contact Resistance,” pp. 1-4. May 2004. EE-Evaluation Engineering. www.evaluationengineering.com.
Stalnaker, Scott et al. “SWTW2003: Controlling Contact Resistance with Probe Tip Shape & Cleaning Recipe Optimization,” pp. 1-31. Jun. 1-4, 2003. Southwest Test Workshop, Long Beach, CA.
Dabrowiecki, Krzysztof R&D Group. “Advances in Conventional Cantilever Probe Card,” pp. 1-28. Jun. 6-9, 1999. Southwest Test Workshop, San Diego, CA.
Tunaboylu, Bahadir et al. “SWTW2003: Vertical Probe Development for Copper Bump Test Challenges,” pp. 1-26. Jun. 2, 2003. Southwest Test Workshop, Long Beach CA.
Lumen Patent Firm, Inc.
Micro-Probe, Inc.
Nguyen Vinh P
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