Probe module and a testing apparatus

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S755090

Reexamination Certificate

active

06937040

ABSTRACT:
A probe module electrically coupled to a terminal of a device under test for sending and/or receiving a signal to and/or from the device under test, includes a first substrate, a probe pin provided on the first substrate to be in contact with the terminal of the device under test, a first signal transmission pattern formed on the first substrate, the first signal transmission pattern being electrically coupled to the probe pin, with a gap formed at the first signal transmission pattern not to transmit any electric signal, and a for short-circuiting or open-circuiting the gap of the first signal transmission pattern.

REFERENCES:
patent: 5442300 (1995-08-01), Nees et al.
patent: 5751151 (1998-05-01), Levy et al.
patent: 6819132 (2004-11-01), Byrd
patent: 8-75758 (1996-03-01), None
patent: 10-197559 (1998-07-01), None
Patent Abstracts of Japan, Publication No. 10-197559, Publication Date Jul. 31, 1998, 1 page.
Patent Abstracts of Japan, Publication No. 08-075758, Publication Date Mar. 22, 1996, 1 page.
Japanese International Preliminary Examination Report dated Apr. 14, 2003, 3 pages.
International Search Report dated Nov. 5, 2002, 2 pages.

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