Probe method

Details Probe method Probe method

1991-05-08

1992-11-24

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324158F, G01R 3128, G01R 3102

Patent

active

051666030

ABSTRACT:
There is executed a probe method wherein probe needles are brought into contact with electrode pads of chips to be measured arranged on a semiconductor wafer and an electronic characteristic thereof is measured in each measuring stage in a probe apparatus having a plurality of measuring stages on one loader. First of all, one opening stage in the measuring stage is detected and the wafer is transferred to the one stage. In one stage, the wafer is loaded on a mount which is operatable in X, Y, Z, and .theta. directions. In consideration of the relationship between the array direction of the chip and a measuring order of the chip and the corresponding relationship between the probe needles and the electrode pads, the wafer is positioned with respect to the probe needles. According to the method, it can be discriminated whether or not the wafer is circular. Also, it can be discriminated whether or not a detecting member having a tactile sense detecting the contact between the probe needles and the chip is used when measuring. Moreover, it can be discriminated whether or not the range of the chips to be measured on the wafer is designated. Also, it can be discriminated whether or not the tips of the needles are polished.

REFERENCES:
patent: 4856904 (1989-08-01), Akagawa
patent: 4899105 (1990-02-01), Akiyama

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