Probe member for wafer inspection, probe card for wafer...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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07656176

ABSTRACT:
A probe member for wafer inspection having a sheet-like probe, the probe including a frame plate in which openings are formed, and contact films arranged on a front surface of the frame plate so as to close the openings, each of the contact films obtained by arranging, in an insulating film formed of a flexible resin, a plurality of electrode structures, and an anisotropically conductive connector, which is composed of a frame plate, in which a plurality of openings have been formed corresponding to the electrode regions, and a plurality of elastic anisotropically conductive films arranged on and supported by the frame plate so as to close the respective openings, wherein each of the openings of the frame plate in the sheet-like probe have a size for receiving the external shape in a plane direction in the elastic anisotropically conductive film of the anisotropically conductive connector.

REFERENCES:
patent: 5828226 (1998-10-01), Higgins et al.
patent: 6215321 (2001-04-01), Nakata
patent: 6969622 (2005-11-01), Kokubo et al.
patent: 7049836 (2006-05-01), Setaka
patent: 7095241 (2006-08-01), Setaka et al.
patent: 7131851 (2006-11-01), Setaka et al.
patent: 2007/0069743 (2007-03-01), Inoue et al.
U.S. Appl. No. 11/718,576, filed May 3, 2007, Yoshioka, et al.

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