Probe head with machined mounting pads and method of forming...

Details Probe head with machined mounting pads and method of forming... Probe head with machined mounting pads and method of forming...

2007-02-20

2007-02-20

Hollington, Jermele (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

11346954

ABSTRACT:
A probe head for testing semiconductor wafers has a probe contactor substrate have a first side and a second side. A plurality of probe contactor tips are coupled to the first side and the plurality of tips lie in a first plane. A plurality of mounting structures are coupled to the second side with each of the mounting structures each having a top surface lying in a second plane, wherein the first plane is substantially parallel to the second plane.

REFERENCES:
patent: 6677771 (2004-01-01), Zhou et al.
patent: 0567332 (1993-10-01), None
patent: WO 2004/056698 (2004-07-01), None
Jun-Bo Yoon et al., Monolithic Integration of 3-D Electroplated Microstructures With Unlimited Number of Levels Using Planarization With A Scarificial Metallic Mold (PSMM), pp. 624 thru 629, no date.

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