Probe head, method for manufacturing the same, and inspecting me

Details Probe head, method for manufacturing the same, and inspecting me Probe head, method for manufacturing the same, and inspecting me

1995-07-20

1997-11-18

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

439 66, 29838, G01R 104, G01R 3128

Patent

active

056891938

ABSTRACT:
Probes include proximal ends electrically connected to the respective conductive patterns of said insulating substrate, and free ends for being contact with the respective electrode pads of the object. The probes can be buckled in such a manner that the free ends are brought into contact with the respective electrode pads of the object under a predetermined contact pressure. Probes are formed from a wire for wire bonding by means of a wire bonder, and include proximal ends wire-bonded to each corresponding conductive patterns on the insulating substrate, and free ends formed by being cut after the wire is wire-bonded to a dummy substrate.

REFERENCES:
patent: 4843315 (1989-06-01), Bayer et al.

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