Probe head assembly

Details Probe head assembly Probe head assembly

1997-05-19

2000-02-22

Karlsen, Ernest

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, G01R 1073

Patent

active

060284374

ABSTRACT:
An apparatus for testing semiconductor devices including probe tips for contacting input/output pads on the device attached to a probe membrane fixed to a package using a layer of elastomeric material. The elastomeric material and use of compliant bump probe tips effect a global planarization for improved electrical contact between the probe assembly and the input/output contacts on the device under test.

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patent: 5806181 (1998-09-01), Khandros et al.
patent: 5808474 (1998-09-01), Hively et al.

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