Probe device for testing an integrated circuit

Details Probe device for testing an integrated circuit Probe device for testing an integrated circuit

1983-09-15

1986-11-18

Eisenzopf, Reinhard J.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

29843, G01R 1073

Patent

active

046238395

ABSTRACT:
A plurality of probes for contacting the pads of an integrated circuit are cantilevered within the aperture of a ceramic ring. The probes are fixed to the ring with an adhesive and a second ceramic ring is positioned on them to support them against contact forces. The probes are soldered to conductive tracks on the first ring for connection to test apparatus, providing a very rigid and dimensionally accurate and stable probe arrangement. The device can be constructed with the probes in contact with a sample integrated circuit, in a quick and simple process.

REFERENCES:
patent: 3560907 (1971-02-01), Heller
patent: 3952410 (1976-04-01), Garretson
Probe-Rite Products Catalog, 1975.
IBM Technical Disclosure Bulletin, Drzewinski, G., et al., "Multipoint Circuit Probe", vol. 18, No. 8, Jan. 1976, pp. 2453-2454.
IBM Technical Disclosure Bulletin, Watson, R., "Quadrant Probe", vol. 14, No. 1, Jun. 1971, pp. 217-218.
IBM Technical Disclosure Bulletin, Byrnes., H., et al., "Deletable Template Method of Test Probe Assembly", vol. 21, No. 5, Oct. 1978, p. 1874.

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