Probe device for integrated circuit wafers

Details Probe device for integrated circuit wafers Probe device for integrated circuit wafers

1977-07-18

1979-07-17

Rolinec, Rudolph V.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

174126C, 324 725, 324158F, G01R 106, G01R 3102

Patent

active

041616928

ABSTRACT:
A probe device for testing integrated circuit wafers is disclosed. The probe device comprises a support means, which has metallized portions, and an aperture. A plurality of "L" shaped holding means, each having a thin metallized surface, are coupled to metallized portions of the support means so that a portion of the holding means extends into the aperture. Coupled to the metallized surface of each of the holding means is a corresponding needle-like probe member which has a curved portion. These probe members are coupled to the holding means in such a manner that their curved portions extend into the support means aperture so as to electrically contact a circuit wafer placed therein, and thereby electrically couple the circuit wafer to the support means, and ultimately to circuit testing apparatus.

REFERENCES:
patent: 2641672 (1953-06-01), Parrish
patent: 3849728 (1974-11-01), Evans

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