Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-03-01
2005-03-01
Chang, Richard (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S426100, C029S882000, C029S846000, C029S876000
Reexamination Certificate
active
06860009
ABSTRACT:
A method of constructing a probe which includes providing a substrate and creating a first substantially asymmetrical recess within the substrate. A conductive material is located within the recess and a conductive trace is electrically connected with the conductive material. A membrane supports the conductive trace, wherein the conductive material is located between the membrane and the substrate. The substrate is removed from the conductive material.
REFERENCES:
patent: 3401126 (1968-09-01), Miller et al.
patent: 3429040 (1969-02-01), Miller
patent: 3541222 (1970-11-01), Parks et al.
patent: 3596228 (1971-07-01), Reed, Jr. et al.
patent: 3634807 (1972-01-01), Grobe et al.
patent: 3654585 (1972-04-01), Wichersham
patent: 3680037 (1972-07-01), Nellis et al.
patent: 3806801 (1974-04-01), Bove
patent: 3862790 (1975-01-01), Davies et al.
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 4027935 (1977-06-01), Byrnes et al.
patent: 4038599 (1977-07-01), Bove et al.
patent: 4184729 (1980-01-01), Parks et al.
patent: 4581679 (1986-04-01), Smolley
patent: 4636722 (1987-01-01), Ardezzone
patent: 4636772 (1987-01-01), Yasunaga
patent: 4649339 (1987-03-01), Grangroth et al.
patent: 4663840 (1987-05-01), Ubbens et al.
patent: 4707657 (1987-11-01), Bøegh-Petersen
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4837507 (1989-06-01), Hechtman
patent: 4906920 (1990-03-01), Huff et al.
patent: 4916002 (1990-04-01), Carver
patent: 4918383 (1990-04-01), Huff et al.
patent: 4922192 (1990-05-01), Gross et al.
patent: 4975638 (1990-12-01), Evans et al.
patent: 4980637 (1990-12-01), Huff et al.
patent: 4987100 (1991-01-01), McBride et al.
patent: 4991290 (1991-02-01), MacKay
patent: 5020219 (1991-06-01), Leedy
patent: 5059898 (1991-10-01), Barsotti et al.
patent: 5061192 (1991-10-01), Chapin et al.
patent: 5069628 (1991-12-01), Crumly
patent: 5097101 (1992-03-01), Trobough
patent: 5126286 (1992-06-01), Chance
patent: 5133119 (1992-07-01), Afshari et al.
patent: 5134365 (1992-07-01), Okubo et al.
patent: 5145552 (1992-09-01), Yoshizawa et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5177438 (1993-01-01), Littlebury et al.
patent: 5180977 (1993-01-01), Huff
patent: 5207585 (1993-05-01), Byrnes et al.
patent: 5225037 (1993-07-01), Elder et al.
patent: 5293175 (1994-03-01), Hemmie et al.
patent: 5326412 (1994-07-01), Schreiber et al.
patent: 5355079 (1994-10-01), Evans et al.
patent: 5367165 (1994-11-01), Toda et al.
patent: 5389885 (1995-02-01), Swart
patent: 5395253 (1995-03-01), Crumly
patent: 5412866 (1995-05-01), Woith et al.
patent: 5453404 (1995-09-01), Leedy
patent: 5506515 (1996-04-01), Godshalk et al.
patent: 5517126 (1996-05-01), Yamaguchi
patent: 5521518 (1996-05-01), Higgins
patent: 5537372 (1996-07-01), Albrecht et al.
patent: 5584120 (1996-12-01), Roberts
patent: 5623213 (1997-04-01), Liu et al.
patent: 5623214 (1997-04-01), Pasiecznik, Jr.
patent: 5720098 (1998-02-01), Kister
patent: 5723347 (1998-03-01), Hirano et al.
patent: 5742174 (1998-04-01), Kister et al.
patent: 5813847 (1998-09-01), Eroglu et al.
patent: 5814847 (1998-09-01), Shihadeh et al.
patent: 5869974 (1999-02-01), Akram et al.
patent: 5876082 (1999-03-01), Kempf et al.
patent: 5896038 (1999-04-01), Budnaitis et al.
patent: 5914613 (1999-06-01), Gleason et al.
patent: 5926029 (1999-07-01), Ference et al.
patent: 5973504 (1999-10-01), Chong
patent: 5974662 (1999-11-01), Eldridge et al.
patent: 6114864 (2000-09-01), Soejima et al.
patent: 6174744 (2001-01-01), Watanabe et al.
patent: 6256882 (2001-07-01), Gleason et al.
patent: 6268016 (2001-07-01), Bhatt et al.
patent: 6351885 (2002-03-01), Suzuki et al.
patent: 20010009061 (2001-07-01), Gleason et al.
patent: 20010030549 (2001-10-01), Gleason et al.
patent: 42 23 658 (1993-01-01), None
patent: 0259163 (1987-03-01), None
patent: 0230348 (1987-07-01), None
patent: 411004001 (1999-01-01), None
patent: WO 9807040 (1997-02-01), None
Electronic Engineers' Handbook, McGraw-Hill Book Company, First Edition; 8 pages, ©1975.
Kim, Yong-Dae, et al.: Fabrication of a Silicon Micro-Probe for Vertical Probe Card Application, In: Japan J. Appl. Phys., vol. 37, 1998, S. 7070-7073.
Bayne Michael A.
Gleason Reed
Koxxy Martin
Lesher Timothy
Smith Kenneth
Cascade Microtech, Inc.
Chang Richard
Chernoff Vilhauer McClung & Stensel, LLP
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