Probe cassette, semiconductor inspection apparatus and...

Details Probe cassette, semiconductor inspection apparatus and... Probe cassette, semiconductor inspection apparatus and...

2005-07-14

2010-02-02

Tang, Minh N (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S756010, C324S757020, C324S761010

Reexamination Certificate

active

07656174

ABSTRACT:
A manufacturing method of a semiconductor device employing a semiconductor inspection apparatus to accurately inspect semiconductor elements while still in the wafer state, the semiconductor inspection apparatus including: a probe sheet31having contact terminals7which contact electrodes3of a wafer1and contact bumps20belectrically connected to respective contact terminals7; and a probe sheet34which is backed by a metal film30band having contact electrodes34awhich contact the contact bumps20bof the probe sheet31and peripheral electrodes27belectrically connected to the respective contact electrodes34a, the wafer1is interposed between the probe sheet34and the supporting member33via the probe sheet31by reducing pressure through vacuuming, and the contact terminals7which have a pyramidal or truncated shape are contacted to the electrodes3of the wafer1at a desired atmospheric pressure, thereby performing the inspection.

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