Probe card with ground shield structure to minimize noise coupli

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324754, G01R 3102

Patent

active

059492457

ABSTRACT:
A probe card for use in a multi-chip probing test equipment with reduced noise coupling effect is disclosed. It contains (a) a multi-layer circuit board with a window formed at a central portion thereof, the multi-layer circuit board containing a number of contact points arranged on the surface ofthe multi-layer circuit board for electrically contacting the test head of the test equipment; (b) a plurality of downward pointing testing pins attached to the multi-layer circuit board and electrically connected to the contact points on the surface ofthe multi-layer circuit board, the testing pins being arranged to face a plurality of semiconductor chips so as to tests to be conducted on the plurality of semiconductor chips; (c) a ground layer formed in the multi-layer circuit board; and (d) a plurality of spaced apart ground paths arranged across the window of the multi-layer circuit board. The plurality of ground paths are connected to the ground layer of the multi-layer circuit board and are arranged so as to separate the testing pins into a plurality of groups each corresponding to a respect semiconductor chip to be tested. The ground layer and the ground paths collectively form a ground shield structure to isolate the semiconductor chips from each other to thereby reduce a ground noise coupling effect between adjacent semiconductor chips during the multi-chip testing.

REFERENCES:
patent: 4780670 (1988-10-01), Cherry
patent: 5382898 (1995-01-01), Subramanian

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