Probe card for testing unencapsulated semiconductor devices

Details Probe card for testing unencapsulated semiconductor devices Probe card for testing unencapsulated semiconductor devices

1991-08-30

1993-01-05

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324 725, 324158F, G01R 102, G01R 104

Patent

active

051774399

ABSTRACT:
A probe card (8,18) for testing unencapsulated semiconductor devices (7,17) wherein the probe card (8,18) is made from a semiconductor material (10). A plurality of pyramidally shaped conductive protrusions or probe tips (11,41) project from the surface of the probe card (8,18) to mate with electrode pads on an unencapsulated semiconductor device (7,17) to be tested. The probe tips (11,41) are formed using standard etch techniques, hence they can be configured to contact electrode pads that reside on the unencapsulated semiconductor device in either a peripheral or area array. Further, the probe card (8,18) is capable of testing integrated circuits in either wafer or die form.

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patent: 4585991 (1986-04-01), Reid et al.
patent: 4764723 (1988-08-01), Strid
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patent: 4963225 (1990-10-01), Lehman-Lamer
patent: 4994735 (1991-02-01), Leedy
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patent: 5034685 (1991-07-01), Leedy
patent: 5061894 (1991-10-01), Ikeda
patent: 5072116 (1991-12-01), Kawade et al.

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