Probe card for IC testing apparatus

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S757020, C324S1540PB

Reexamination Certificate

active

06292005

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an IC testing apparatus for testing a semiconductor integrated circuit device or other various types of electronic devices (hereinafter referred to as an “IC” as a representative example), more particularly relates to a probe card used for connecting a test head and a device under test.
2. Description of the Related Art
A large number of semiconductor integrated circuit devices are formed on a silicon wafer etc., then go through various processes such as dicing, wire bonding, and packaging to complete electronic devices. Such ICs are tested operationally before shipment. These tests of the ICs are conducted in either the state of the completed products or the wafer state.
As an IC testing apparatus for testing ICS in the wafer state, there is known the one disclosed in Japanese Utility Model Publication (Kokai) No. 5-15431, for example. In this IC testing apparatus, zero insertion force connectors are attached to reduce the force for pressing a probe card provided with needles (pin contacts) from the test head and thereby poor contact due to deformation of the probe card is prevented.
In the conventional probe card, however, since the distance from the needles to the contacts of the zero insertion force connectors connected to the same was uneven, there was the problem that the impedances of the wiring patterns differed and the electrical characteristics fluctuated.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a probe card for an IC testing apparatus superior in electrical characteristics.
(1) According to the present invention, there is provided a probe card for an IC testing apparatus to be electrically connected to a test head board of the IC testing apparatus and having a plurality of needle contacts for electrical contact with a device under test provided on its main surface,
wherein a plurality of connectors electrically connected to said needle contacts are provided at substantially radial positions from the position where said needle contacts are provided.
In this invention, the connector is not particularly limited, but preferably the connector is zero insertion force connector.
In the probe card for an IC testing apparatus of the present invention, since the connectors are provided at substantially radial positions from the position where the needle contacts are provided, the distance between the needle contacts and the contacts of the connectors connected to them can be set uniformly. Therefore, it is possible to make the impedances of the wirings from the needle contacts to the connectors uniform and thereby possible to suppress fluctuations in the electrical characteristics.
The “substantially radial positions” of the present invention mean positions or areas of substantially equal distances (distances from center point) fanning out radially from the position or area where the-needle contacts are provided and do not mean strict radial shapes geometrically. The point is that the all positions are included where the impedances of the wiring connecting the needle contacts and contacts of the connectors become uniform enough not to have an effect on the electrical characteristics of the probe card. (2) In the above invention, the specific means for arranging the zero force connectors substantially radially from the position where the needle contacts are provided is not particularly limited, but as one embodiment, it is possible to mention a probe card for an IC testing apparatus wherein a board is formed in a circular shape, said needle contacts are provided at the substantial center of the board, and said parts of the zero insertion force connectors are provided at outer circumferential edges of the board.
When the device under test is a logic type IC etc., a small number of one or two devices under test are often simultaneously measured, but in this case the main surface of the board can be used efficiently and the distance between the needle contacts and zero insertion force connectors can be easily laid out uniformly by providing the needle contacts at the substantial center of the board and providing the zero insertion force connectors at the outer circumferential edges of the board.
The “zero insertion force connectors” referred to in the present invention mean connectors of a type not requiring application of force in the direction or insertion or withdrawal when inserting together or pulling apart parts of the zero insertion force connectors. The specific structure is not particularly limited.
Further scope of the applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.


REFERENCES:
patent: 4382228 (1983-05-01), Evans
patent: 4563640 (1986-01-01), Hasegawa
patent: 5691651 (1997-11-01), Ehlermann
patent: 5729150 (1998-03-01), Schwindt

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