Probe card device used in probing apparatus

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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G01R 1073

Patent

active

058251928

ABSTRACT:
A probe card device used in a probing apparatus for testing the electrical characteristics of a semiconductor wafer by bringing bump electrodes into contact with a plurality of electrode pads of the wafer comprises a probe card, a support block for supporting the probe card, and a pushing mechanism for pushing the probe card toward the wafer. The pushing mechanism includes a pushing member divided into a plurality of blocks, and a support member for supporting each of the divided blocks. These plural blocks are movable independently and serve to push the wafer in a manner to follow a surface profile of the wafer.

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patent: 5339027 (1994-08-01), Woith et al.
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patent: 5563521 (1996-10-01), Crumly
patent: 5604446 (1997-02-01), Sano
patent: 5672977 (1997-09-01), Yamada

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