Probe card assembly for high density integrated circuits

Details Probe card assembly for high density integrated circuits Probe card assembly for high density integrated circuits

1996-11-06

1998-10-27

Brown, Glenn W.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324757, 324761, G01R 1073

Patent

active

058282262

ABSTRACT:
A probe card assembly includes a probe card, an interposer and a probe array. The probe array includes a plurality of closely spaced pins, each pin includes a post and a beam, and each beam has a first end attached to the top of a post and a second end for contacting an integrated circuit. A bead on the second end of the beam assures that the free end of the beam will contact an IC first. For contacts on a grid, the beams extend diagonally relative to the rows and columns of the grid, enabling the beams to be longer. For contacts in a row on centers closer than the pins, two rows of pins straddle the contacts and the beams extend toward the contacts from opposite sides of the contacts. The probe array can be formed on the high density side of the interposer.

REFERENCES:
patent: 4899099 (1990-02-01), Mendenhall et al.
patent: 4932883 (1990-06-01), Hsia et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5534784 (1996-07-01), Lum et al.
patent: 5625298 (1997-04-01), Hirano et al.
patent: 5703494 (1997-12-01), Sano

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