Probe card assembly and method of manufacturing probe card assem

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324754, G01R 3102

Patent

active

055215238

ABSTRACT:
A probe card assembly thermal influenced from a wafer with which a probe makes contact during a probe test. The assembly includes a probe card unit having a great number of probes to be brought into contact with the wafer to be tested, and a holder for holding the probe card unit at a center portion thereof. The holder includes a ring member, supported by another member, for supporting the probe card unit from a low side, and a cutout stepped member and a slot hole for relaxing stress due to thermal expansion concentrated on the ring member.

REFERENCES:
patent: 3963985 (1976-06-01), Geldermans
patent: 5077523 (1991-12-01), Blanz
patent: 5124639 (1992-06-01), Carlin
patent: 5198753 (1993-03-01), Hamburgen

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