Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – For receiving coaxial connector
Reexamination Certificate
2005-02-15
2005-02-15
Gushi, Ross (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
For receiving coaxial connector
Reexamination Certificate
active
06854980
ABSTRACT:
The present invention provides a probe card comprising a substrate and an external connection terminal located on substrate, wherein external connection terminal1is separated from a body of substrate by conductors attached to the substrate, whereby the waiting time due to dielectric absorption can be constantly shortened, and the steady-state leakage current can be stably reduced, thereby enhancing the accuracy of measuring microcurrents and determining microcurrent fluctuations for semiconductor wafer testing devices.
REFERENCES:
patent: 5933017 (1999-08-01), Bessho et al.
patent: 6034533 (2000-03-01), Tervo et al.
patent: 64-47042 (1989-03-01), None
patent: 08-279314 (1996-10-01), None
patent: 08-330369 (1996-12-01), None
patent: 08-335754 (1996-12-01), None
patent: 11-044709 (1999-02-01), None
Agilent Technologie,s Inc.
Gushi Ross
Nguyen Phuongchi
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