Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2005-08-23
2005-08-23
Nguyen, Vinh (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S755090
Reexamination Certificate
active
06933737
ABSTRACT:
In the probe card of the semiconductor device measurement device, measurement is to be done in the stability without damage beyond the needle diameter on the pad of the wafer by the probe needle. The straight probe needle5is inserted in the upper guide plate2, the rotary guide plate3and the bottom guide plate4. The rotary guide plate3is a little displaced, and the center of the probe needle5is bent. Under this condition, the stage with the wafer thereon is raised, and then the tip of the probe needle5reaches the pad on the surface of the wafer. The rotary guide plate3has a guide slot7. The rotary guide plate3is moved in the horizontal plane. The fixed guide pin8moves along the guide slot7. The probe needle5rotates like swinging. The probe needle5breaks through the natural oxide film stuck on the pad. In this way, the dispersion of the pressure of the probe needle5is prevented. Measurement can be done without damage beyond the needle diameter on the pad of the wafer. Moreover, the pitch of the probe needle5can be narrow, and assembling becomes easy.
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patent: 4963822 (1990-10-01), Prokopp
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patent: 6426637 (2002-07-01), Dang et al.
patent: 2001/0028255 (2001-10-01), Endo
Chan Emily Y
Dellett & Walters
Iwasaki Correspond Industry Co., Ltd.
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