Probe assembly for testing integrated circuits

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324754, 324758, 324 725, G01R 104

Patent

active

054164290

ABSTRACT:
A probe assembly for testing an integrated circuit includes a probe card of insulating material with a central opening, a rectangular frame with a smaller opening attached to the probe card, four separate probe wings each comprising a flexible laminated member having a conductive ground plane sheet, an adhesive dielectric film adhered to the ground plane, and probe wing traces of spring alloy copper on the dielectric film. Each probe wing has a cantilevered leaf spring portion extending into the central opening and terminates in a group of aligned individual probe fingers provided by respective terminating ends of said probe wing traces. The probe fingers have tips disposed substantially along a straight line and are spaced to correspond to the spacing of respective contact pads along the edge of an IC being tested. Four spring clamps each have a cantilevered portion which contact the leaf spring portion of a respective probe wing, so as to provide an adjustable restraint for one of the leaf spring portions. There are four separate spring clamp adjusting means for separately adjusting the pressure restraints exercised by each of the spring clamps on its respective probe wing. The separate spring clamp adjusting means comprise spring biased platforms each attached to the frame member by three screws and spring washers so that the spring clamps may be moved and oriented in any desired direction to achieve adjustment of the position of the probe finger tips on each probe wing.

REFERENCES:
patent: 3867698 (1975-02-01), Beltz et al.
patent: 3891924 (1975-06-01), Ardezzone
patent: 4574235 (1986-03-01), Kelly
patent: 4719417 (1988-01-01), Evans
patent: 4899099 (1990-02-01), Mendenhall et al.
patent: 4975638 (1990-12-01), Evans et al.
patent: 5041782 (1991-08-01), Marzan
patent: 5059898 (1991-10-01), Barsotti
patent: 5066907 (1991-11-01), Tarzweil et al.
patent: 5084672 (1992-01-01), Ikeushi et al.
patent: 5128612 (1992-07-01), Aton
patent: 5148103 (1992-09-01), Pasiecznik, Jr.
patent: 5156649 (1992-10-01), Compton et al.
patent: 5214375 (1993-05-01), Ikeuchi
patent: 5221895 (1993-06-01), Janko
patent: 5307012 (1994-04-01), Bhattacharyya et al.

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