Probe assembly for testing

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324762, G01R 102

Patent

active

060844205

ABSTRACT:
An apparatus for probing a semiconductor wafer includes one or more probe tips, the position of each being self-adjustable according to the pressure and direction of the pressure applied to it. In the present invention, elastic probe assemblies (which include the probe tips) independently move to compensate when the wafer expands in size due to thermal expansion and/or changes of probing pressure.

REFERENCES:
patent: 5172050 (1992-12-01), Swapp
patent: 5666063 (1997-09-01), Abercrombie et al.
patent: 5763879 (1998-06-01), Zimmer et al.
patent: 5859539 (1999-01-01), Wood et al.
patent: 5909123 (1999-06-01), Budnaitis

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