Probe assembly and method for switchable multi-DUT testing of in

Details Probe assembly and method for switchable multi-DUT testing of in Probe assembly and method for switchable multi-DUT testing of in

1997-04-17

1999-07-13

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324757, 324762, G01R 3102

Patent

active

059231785

ABSTRACT:
A system for testing an integrated circuit on a semiconductor wafer so as to achieve low probe needle contact resistance with low probe needle force and without substantial scrubbing includes a probe and supporting a plurality of probe needles electrically coupled to an electrical test system above and in alignment with a plurality of contact pads of the integrated circuit, respectively. The wafer is mechanically moved to press probe needles to bring a tip of each probe needle into physical contact with a corresponding contact pad, and is further moved to increase a needle force of each tip against the corresponding contact pad and cause flexing of a curved portion of each probe needle. Each probe needle is curved such that the flexing causes the tip of each probe needle to rock without appreciable sliding on the surface of the contact pad. The rocking and the needle force combine to cause lateral displacement of oxide from between the tip and metal of the contact pad, allowing reliable, low resistance electrical contact between the tip and the contact pad.

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