Probe area setting method and probe device

Details Probe area setting method and probe device Probe area setting method and probe device

2003-02-18

2008-12-09

Ahmed, Samir A (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C324S754090, C324S758010

Reexamination Certificate

active

07463764

ABSTRACT:
With a wafer having an indefinite shape or a broken wafer, it is hard for an operator to assign the design address of an edge chip and set a probe area. In a probe-area setting method of this invention, a wafer W is placed on a main chuck (18) that is movable at least in the X- and Y-directions. The main chuck (18) is moved, thus moving wafer W in the X- and Y-directions. All edge chips formed on the wafer W are retrieved by means of an upper camera (21A), thereby setting a probe area. To retrieve the edge chips, an edge chip is selected as one with which the retrieval should be started. The edge chips are successively retrieved in the turning direction of the wafer, as the chip retrieval direction is changed to the X- or Y-direction.

REFERENCES:
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patent: 1-86531 (1989-03-01), None
patent: 64-86531 (1989-03-01), None
patent: 7-58175 (1995-03-01), None
patent: 7058175 (1995-03-01), None
patent: 8-37213 (1996-02-01), None
patent: 8037213 (1996-02-01), None

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