Probe apparatus for testing multiple integrated circuit dies

Details Probe apparatus for testing multiple integrated circuit dies Probe apparatus for testing multiple integrated circuit dies

1993-11-12

1996-05-28

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, G01R 106

Patent

active

055215220

ABSTRACT:
There is provided a probe apparatus with a stage for holding a wafer on which a plurality of chips are regularly arranged such that the chips are arranged substantially in an XY plane, a large number of contactors facing the wafer held on the stage, provided to corresponding to respective pads of the chips such as to be brought into contact collectively with the pads of all the device circuits on the wafer, tester for transmitting/receiving a test signal to/from the device via the contactors, elevator device for elevating the stage in a Z-axis direction, alignment device for moving the stage in an X-axis and/or Y-axis direction, and controller for controlling the alignment device and the elevator device.

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patent: 5412329 (1995-05-01), Iino et al.
patent: 5416592 (1995-05-01), Mori et al.

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