Probe apparatus and burn-in apparatus

Details Probe apparatus and burn-in apparatus Probe apparatus and burn-in apparatus

1994-05-31

1996-04-23

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324758, 324765, 414416, G01R 3102

Patent

active

055107249

ABSTRACT:
A loader section for supplying semiconductor wafers is arranged at one end of a linear first convey path for a convey unit. Burn-in test sections, probe test sections, a laser repair section, a deposition repair section, a marking section, a baking section, and visual test sections are arranged on both the sides of the first convey path. In the burn-in test section arranged in the loader section, each semiconductor wafer picked up from a cassette is pre-aligned. The pre-aligned semiconductor wafers are loaded/unloaded into/from the respective test sections and the repair section by the convey unit in accordance with a predetermined test procedure, thereby performing a plurality of test items and repair steps by an inline scheme. Each burn-in test section includes a probe card having conductive projections which are brought into contact with all of many semiconductor chips formed on each semiconductor wafer at once. Each burn-in test section performs burn-in tests on a plurality of semiconductor chips with which the conductive projections are brought into contact at once, while temperature/voltage stresses are applied to the semiconductor chips.

REFERENCES:
patent: 4567432 (1986-01-01), Buol et al.
patent: 4775281 (1988-10-01), Prentakis
patent: 5084671 (1992-01-01), Miyata et al.
patent: 5148100 (1992-09-01), Sekiba
patent: 5292393 (1994-03-01), Maydan et al.

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