Probe apparatus

Details Probe apparatus Probe apparatus

1993-08-31

1995-10-24

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

3241581, 324 725, 324 731, G01R 3102

Patent

active

054613272

ABSTRACT:
A probe apparatus tests the electrical characteristics of chips formed on a semiconductor wafer by bringing probes into contact with pads of each chip. The probes, which include ones for power supply potentials, signals, and ground potential, are mounted vertically penetrating a ring block which is attached to the center of a main PCB of a probe card. A tray containing a number of fuses is mounted over the probe card by means of struts. The fuses in the tray connect wires of the main PCB, to which the supply potential of a DC power source is applied, and their corresponding probes. The fuses and the tray can be collectively removed from the probe card to be replaced with new ones.

REFERENCES:
patent: 3493858 (1966-01-01), Baron
patent: 3979671 (1976-09-01), Meeker
patent: 4510445 (1985-04-01), Kvaternik
patent: 4633175 (1986-12-01), Ritchie
patent: 5081415 (1992-01-01), Liu
patent: 5172053 (1992-12-01), Itoyama
patent: 5198753 (1993-03-01), Hamburgen
patent: 5325052 (1994-06-01), Yamashita

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