Probe apparatus

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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G01R 104

Patent

active

053999835

ABSTRACT:
A semiconductor probe method and apparatus for avoiding collision between probe and semiconductor. A method of the present invention includes the step of setting a probe card adjacent a semiconductor wafer which is to be tested. A reading location data step then reads semiconductor wafer location data. A high speed advancing step then moves the probe card and semiconductor wafer together at a sufficiently high speed. A low speed advancing step then moves the probe card and semiconductor wafer together at a low speed. Finally, a detecting step detects when probe card needles contact the semiconductor wafer, at which point, the engaging operation is stopped and contact point data is stored in memory. A probe apparatus includes a probe card holder for supporting a probe card including probe needles. A memory element is arranged on the probe card and contains data of the position of the probe needles. Supporting means are provided for supporting a semiconductor wafer having a plurality of electrode pads, and for vertically moving the wafer. A control system for attaining a level of the probe needles of the probe card based on data read from the memory element of the probe card holder is also provided. The control system drives the supporting means at a high speed, then at a low speed such that the electrode pads of the wafer approach the tips of the probe needles while avoiding a collision.

REFERENCES:
patent: 4195259 (1980-03-01), Reid et al.
patent: 4755747 (1988-07-01), Sato
patent: 5065103 (1991-11-01), Slinkman et al.
patent: 5177438 (1993-01-01), Littlebury et al.

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