Probe apparatus

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324757, G01R 3102

Patent

active

056729774

ABSTRACT:
The probe apparatus for a semiconductor wafer has a work table on which a wafer is placed. A printed wiring board having a high rigidity is situated above the work table. A support block is mounted on the printed wiring board so as to pierce through its opening. The support block has a recess which opposes to the work table, and a flexible membrane-like probe card is detachably mounted on the support block so as to cover the recess. The probe card has a main region in which contact elements to be brought into contact with electrode pads of the semiconductor wafer are arranged. A rigid rectangular frame is attached to the rear surface of the probe card so as to surround the main region, thus imparting a flatness to the probe card. A pusher is provided in the recess of the support block so as to be brought into contact with the rear side of the main region of the probe card. The pusher is swingably arranged on the lower end of the shaft vertically supported. The shaft is supported by the support block via two belleville springs.

REFERENCES:
patent: 4906920 (1990-03-01), Huff et al.
patent: 5180977 (1993-01-01), Huff
patent: 5416429 (1995-05-01), McQuade et al.
patent: 5461326 (1995-10-01), Woith et al.

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