Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed
Patent
1995-04-21
1997-09-09
Niebling, John
Semiconductor device manufacturing: process
With measuring or testing
Optical characteristic sensed
324765, 438 17, 382145, H01L 2166
Patent
active
056656092
ABSTRACT:
A method for identifying those process steps which produce "high risk" particulate contamination that is most likely to produce defects. The die positions of particulate deposits on a wafer are measured prior to and subsequent to a specific process step, to determine the die positions of particulate deposits introduced during that specific process step. Then, subsequent electrical tests of the wafer are used to determine which locations on the wafer contain faulty circuitry. The locations of particulate deposits introduced during the specific process step are then correlated to the locations of faulty circuitry. The result is a measure of the extent to which particulate deposits introduced during the specific process step contribute to reductions in yield of the manufacturing process.
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Borden et al, "Benfits of Real-Time, Insitu Particle Monitoring In Production Current Implantation", IEE Trasactions on Semiconductor Manufacturing, vol. 2 No. 4, Nov. 1989, pp. 141-145.
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Mulpuri S.
Niebling John
Sony Corporation
Sony Electronics Inc.
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