Printing with differential adhesion

Details Printing with differential adhesion Printing with differential adhesion

2005-05-31

2005-05-31

Pianalto, Bernard (Department: 1762)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C216S094000, C216S095000, C427S208200, C427S208400, C427S261000, C427S264000, C427S265000, C427S271000, C427S290000, C427S299000, C427S331000, C427S348000, C427S355000, C427S369000, C427S385500, C427S407100, C427S511000, C427S533000, C427S555000, C427S558000, C427S559000, C427S595000, C427S596000

Reexamination Certificate

active

06899775

ABSTRACT:
This invention relates to the printing of a substrate having a pre-printed “print pattern” with a “design layer” of ink where there is differential adhesion within and without the print pattern. The print pattern is receptive to an ink, and the design layer ink forms a durable image material with good bond to the print pattern, but the ink does not form a durable image material on the portions of the substrate outside the print pattern. The design layer ink is a UV-curable ink, and the print pattern may have a higher surface energy than the portions of the substrate outside the print pattern.

REFERENCES:
patent: 4673609 (1987-06-01), Hill
patent: 4925705 (1990-05-01), Hill
patent: 5609938 (1997-03-01), Shields
patent: 6210776 (2001-04-01), Hill
patent: RE37186 (2001-05-01), Hill
patent: 6267052 (2001-07-01), Hill et al.
patent: 0 540 203 (2001-10-01), None
patent: 2 118 096 (1984-02-01), None
patent: WO 00/46043 (2000-08-01), None

Affiliated with

Also associated with

Rating

Printing with differential adhesion does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printing with differential adhesion, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printing with differential adhesion will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3403756