Printing wiring board(s) having polyimidebenzoxazole dielectric

Details Printing wiring board(s) having polyimidebenzoxazole dielectric Printing wiring board(s) having polyimidebenzoxazole dielectric

1995-05-09

1997-09-23

Yamnitzky, Marie

Stock material or miscellaneous articles

Composite

Of metal

428209, 428332, 428457, 4284735, 428901, 361750, B32B 1508, H05K 102

Patent

active

056702620

ABSTRACT:
A film of polyimidebenzoxazole (PIBO) having an electrically conductive layer adhered to at least one face thereto, wherein the PIBO film has a tensile strength greater than 200 MPa. A printed wiring board having at least one dielectric layer and at least one circuitry layer wherein at least one dielectric layer is a PIBO film. A printed wiring board (PWB) having at least one polyimidebenzoxazole (PIBO) dielectric layer wherein the PWB has at least one thin dielectric base material layer, at least one thin conductor, at least one narrow conductor width and at least one small diameter via.

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David J. Powell, "A New, Non-Woven Aramid Reinforcement for PWBs and MCM-L's," Circuitree, Nov. 1994, pp. 50 & 52.
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Coombs, Printed Circuit Handbook, 1988, pp. 3.22-3.23.

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