Printing screen and method of printing a non-absorbent substrate

Details Printing screen and method of printing a non-absorbent substrate Printing screen and method of printing a non-absorbent substrate

1988-03-01

1990-09-25

Crowder, Clifford D.

Printing

Stenciling

Stencils

101129, 427282, B41F 1536, B05D 132

Patent

active

049585606

ABSTRACT:
A method of screen printing a hard non-absorbent substrate, such as glass, using a screen with a patterned coating on its surface facing the substrate comprises providing local support between the screen surface and the substrate in one or more areas in which a patterned ink layer of increased thickness is required, thereby enhancing ink retention in those areas. The method is especially useful for printing patterns of varying thickness in selected locations, for example, for printing heater arrays in conductive ink on vehicle windows. The invention also includes novel screens for use in the method.

REFERENCES:
patent: 3023697 (1962-03-01), Benavides et al.
patent: 3759800 (1973-09-01), Reinke
patent: 3813519 (1974-05-01), Jochim et al.
patent: 3852564 (1974-12-01), Baum et al.
patent: 3900634 (1975-08-01), Plumat et al.
patent: 4084506 (1978-04-01), Nakatani
patent: 4301189 (1981-11-01), Arai et al.
patent: 4324815 (1982-04-01), Mitani et al.
patent: 4379737 (1983-04-01), Mearig
patent: 4791006 (1988-12-01), Galvagni et al.
Brady et al., "Screening Mask for Depositing Large Area Paste Deposits", IBM Tech. Disc. Bul., vol. 20, No. 9, pp. 3429-3430; Feb. 1978.

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