Printing of multi-layer circuits

Details Printing of multi-layer circuits Printing of multi-layer circuits

2007-08-15

2009-12-01

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S847000, C029S830000, C029S831000, C029S832000, C427S011000, C427S446000, C427S452000, C427S096100

Reexamination Certificate

active

07624500

ABSTRACT:
The disclosure relates to circuits and methods for the manufacture of circuits, such as those which avoid the formation of undesirable short circuit paths. One such method maintains a layout area of a fluid composition receiving layer within a layout area of a dielectric layer. Another such method relates to the application of fluid composition receiving layers, conductive layers, and dielectric layers, such as in the provision of printed circuits.

REFERENCES:
patent: 5600099 (1997-02-01), Crotzer et al.
patent: 2006/0160432 (2006-07-01), Silveston-Keith
patent: 2008/0044634 (2008-02-01), Enciu et al.

Affiliated with

Also associated with

Rating

Printing of multi-layer circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printing of multi-layer circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printing of multi-layer circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4121794